The following table shows both current and projected capabilities of our China Plants, Suzhou and Wuxi.
| Capability | Current |
2012 to 2013 |
||
|---|---|---|---|---|
Suzhou |
Wuxi |
Suzhou |
Wuxi |
|
| Plant Capacity (Kilo sq. feet/Month) | 750 |
800 |
800 |
850 |
| Layer Count (MAX, MIN =2 ) | 2 to 12 L |
2 to 18 L |
12 L |
20 L |
| Line Width/Spacing | ||||
0.0040" (0.01 mm) |
||||
0.0030" (0.076 mm) |
||||
0.00275" (0.069 mm) |
||||
| Drill Size | ||||
| Mechanical | ||||
0.008" (0.2 mm) |
||||
0.006" (0.15 mm) |
||||
| Laser | ||||
0.004" (0.10 mm) |
||||
| Electrical Test Pitch | ||||
0.016" (0.40 mm) |
||||
0.008" (0.20 mm) |
||||
| Board Thickness | ||||
2L - 0.024" (0.60 mm) |
||||
2L - 0.008" (0.20 mm) |
||||
4L - 0.024" (0.60 mm) |
||||
4L - 0.012" (0.30 mm) |
||||
10L - 0.032" (0.80 mm) |
||||
| Board Finishing | ||||
HASL |
Sub-contract
|
Sub-contract |
Sub-contract |
Sub-contract |
Electroless Ni/ Immersion Gold |
||||
OSP |
Done at GulTech WX |
Done at GulTech WX |
||
Carbon Print |
Done at GulTech WX |
Done at GulTech WX |
||
Immerson Sliver |
||||
Lead Free HASL |
Sub-contract
|
Sub-contract |
Sub-contract |
Sub-contract |
Selective ENIG + OSP |
||||
Immersion Tin |
Done at GulTech SZ |
Done at GulTech SZ |
||
ENIG thick Gold |
||||
Electrolytic Bondable soft Gold |
||||
| Materials | ||||
Normal FR4 (Tg 135°C to 170°C) |
||||
Lead-Free FR4 (Tg 150°C to 170°C) |
||||
Halogen-Free FR4 (Tg 150°C to 170°C |
||||
BT material (Tg 185°C) |
||||
| Special Process/Product | ||||
Controlled Impedance |
||||
Blind/Buried Via |
Done at GulTech WX |
Done at GulTech WX |
||
Differential Impedance |
||||
Regal/Rigid Flex |
||||
Laser Vias |
Done at GulTech WX |
Done at GulTech WX |
||
Regal/Flex with uvias/buried vias |
||||
HDI3 + N + 3 (stacked via) |
||||